"10 Tips For Streamlining PCB Thermal Design"

 Siemens is offering a new book: "Ten Tips For Streamlining PCB Thermal Design". Timing issues can be affected by temperature differences between components. Thermal issues with the PCB design are largely locked in during the component (i.e. chip package) selection and layout phases. After this point only remedial actions are possible if components are found to run too hot. Might be worth taking a look here! https://snip.ly/r11pbu

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